CEPT Signs MoU with Autodesk

This partnership is expected to strengthen industry-academia collaboration, particularly in areas of BIM-enabled construction workflows and new digital initiatives. It goes beyond the routine access to software that is already available to all educational institutions in the country.

The MoU signing ceremony was attended by both Autodesk and CEPT’s leadership teams. The ceremony was followed by an expert talk on ​‘Emerging Aspects of Technology in the AEC Industry’ by Conway Kang Wei Goh, Director, APAC and Japan, Autodesk Education Experiences.

Under the MoU, the two organisations will collaborate on curriculum development across Architecture & Planning, Construction Management, Design and Engineering programs; incorporating tools, data-driven design, and digital construction workflows into CEPT’s academic programs. The initiative will also enable faculty development, Autodesk Certified Professional (ACP) pathways, student bootcamps, workshops, hackathons, design competitions, academic – industry engagements and cloud-based software access for immersive learning.

It reaffirms CEPT’s commitment to practice-oriented education and positions the University at the forefront of the use of digital tools for improving the built environment.